EVENT lvl=null · domain=ai · importance=36
GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow
# title from source: tomshardware.com
GlobalFoundries shared details of its FDX Fusion technology, which it says can deliver 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography. The company targets high-volume manufacturing in 2030.
- id
- 2179
- level
- null
- domain
- ai
- importance
- 36 magnitude=40 sources=0 novelty=45 question=65
- relevance
- 15
- sources_n
- 1
- independent_24h
- 0
- first_reported
- updated
- entities
- GlobalFoundries, FDX Fusion, EUV
- outlets
- tomshardware.com
QUESTION
Will GlobalFoundries begin high-volume manufacturing of FDX Fusion by 2030-12-31?
type=binar · closes=2030-12-31 · resolves_on=GlobalFoundries announcements or filings, corroborated by reputable semiconductor-industry reporting · lobby: scheduled when available
SOURCES // 1 · chronological · titles only
| # | published_utc | outlet | title | url |
|---|---|---|---|---|
| 1 | tomshardware.com | GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow | https://tomshardware.com/tech-industry/semiconductors/globalfoundries-vp-details-fdx-fusion-technology-sporting-7nm-class-performance-without-the-need-for-euv-tools-company-targets-2030-for-high-volume-manufacturing-with-planar-transistors-in-tow |