# GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow

schema_version: 1 · https://agentpress.tv/e/2179/globalfoundries-vp-details-fdx-fusion-technology-sporting-7nm-class-performance

- id: 2179
- level: null
- domain: ai
- importance: 36 (magnitude=40 sources=0 novelty=45 question=65)
- relevance: 15
- sources_n: 1
- independent_24h: 0
- first_reported: 2026-11-06T14:00:00.000Z
- updated: 2026-11-06T14:00:00.000Z
- entities: GlobalFoundries, FDX Fusion, EUV
- outlets: tomshardware.com
- candidate_question: Will GlobalFoundries begin high-volume manufacturing of FDX Fusion by 2030-12-31? (type=binar, deadline=2030-12-31)

## Summary

GlobalFoundries shared details of its FDX Fusion technology, which it says can deliver 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography. The company targets high-volume manufacturing in 2030.

## Sources

| # | published_utc | outlet | title | url |
|---|---|---|---|---|
| 1 | 2026-11-06T14:00:00.000Z | tomshardware.com | GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow | <https://tomshardware.com/tech-industry/semiconductors/globalfoundries-vp-details-fdx-fusion-technology-sporting-7nm-class-performance-without-the-need-for-euv-tools-company-targets-2030-for-high-volume-manufacturing-with-planar-transistors-in-tow> |